Photonic-integrated-circuit fabrication process
文献类型：专利
| 作者 | KOCH, THOMAS LAWSON; KOREN, UZIEL |
| 发表日期 | 1990-02-28 |
| 专利号 | EP0356190A2 |
| 著作权人 | AT&T CORP. |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Photonic-integrated-circuit fabrication process |
| 英文摘要 | An improved process for fabricating photonic circuits is disclosed. The inventive process starts with a growth of a base wafer comprising a stack of epitaxial layers of various materials. At least a portion of each of the material layers will ultimately be a functioning part of any of a number of devices which will form the PIC or will serve a role in at least one of the fabrication processing steps. Specific inventive processing steps are addressed to (1) interconnecting passive waveguides, active devices, and grating filtering regions without the substantial optical discontinuities which appear in the prior art, and (2) etching continuous waveguide mesas to different depths in different regions of the PIC so as to optimize the performance of each PIC device. |
| 公开日期 | 1990-02-28 |
| 申请日期 | 1989-08-21 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/67858]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AT&T CORP. |
| 推荐引用方式 GB/T 7714 | KOCH, THOMAS LAWSON,KOREN, UZIEL. Photonic-integrated-circuit fabrication process. EP0356190A2. 1990-02-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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