Stem for semiconductor laser
文献类型:专利
作者 | YONEKURA HIROMI |
发表日期 | 1983-09-29 |
专利号 | JP1983164285A |
著作权人 | TOUSHIBA COMPONENTS KK |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Stem for semiconductor laser |
英文摘要 | PURPOSE:To obtain a stem which has preferable heat dissipation by forming a lead wirings passing hole and a block engaging hole at a stem body and engaging the element holding block with the hole. CONSTITUTION:A lead wirings passing hole 21 and a block engaging hole 22 are opened at a stem body 20 made of glass sealing Fe alloy or Fe. The hole 22 is a semicircular through hole, engages a block 23 of preferable thermoconductive material such as Cu or the like, and is formed so that the body 20 and the lower surface are aligned in the same plane. Lead wirings are passed via a glass sealing material 25 through the hole 21, and secured simultaneously upon soldering of the block 23. According to this structure, even if it is treated at a high temperature, the thermal expansion difference between the seal 25 and the body 20 is small. Accordingly, the lead wirings can be effectively secured, and since the end face of the block 23 is contacted directly with a heat radiator, the heat dissipation can be largely improved. |
公开日期 | 1983-09-29 |
申请日期 | 1982-03-25 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/70473] |
专题 | 半导体激光器专利数据库 |
作者单位 | TOUSHIBA COMPONENTS KK |
推荐引用方式 GB/T 7714 | YONEKURA HIROMI. Stem for semiconductor laser. JP1983164285A. 1983-09-29. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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