Submounting device for semiconductor laser
文献类型：专利
| 作者 | OOTSUKA NAOTAKA |
| 发表日期 | 1984-09-29 |
| 专利号 | JP1984172787A |
| 著作权人 | SHARP KK |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Submounting device for semiconductor laser |
| 英文摘要 | PURPOSE:To enable to conduct the Joule heat generated at a P-N junction to a heat sink member with good efficiency by a method wherein silicon is used as a submounting member, and many micro recesses are formed on the junction surface of the heat sink side of said member. CONSTITUTION:A semiconductor laser element 2 is brazed to a submounting member 6 with a solder 3, and a heat sink member 4 is brazed to said member 6 with a solder 5. The many recesses 7 are previously formed on the junction surface of the heat sink side of the submounting member 6. As the heat sink member 4, a metal excellent in thermal conductivity such as Cu and Ag is used, and Si is used as the submounting member 6. E.g. In, Sn, and In-Sn alloy is used for the solder 5 and 6. |
| 公开日期 | 1984-09-29 |
| 申请日期 | 1983-03-22 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70514]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KK |
| 推荐引用方式 GB/T 7714 | OOTSUKA NAOTAKA. Submounting device for semiconductor laser. JP1984172787A. 1984-09-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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