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文献类型：专利
| 作者 | FUKUDA MITSUO; HIGUCHI HIDEYO; NAMISAKI HIROBUMI; SUZAKI WATARU |
| 发表日期 | 1992-02-04 |
| 专利号 | JP1992006114B2 |
| 著作权人 | NIPPON DENSHIN DENWA KK |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | - |
| 英文摘要 | PURPOSE:To improve the reliability by employing atmospheric gas in a package for gastightly sealing a semiconductor light emitting element gas which contains oxygen, thereby suppressing the deterioration of the element. CONSTITUTION:A heat sink 2 in which a BCLD (Buried Crescent LD) chip 1 is soldered is mounted on a stem 4. Then, a cap 6 is welded to the stem 4 in dry air atmosphere 5. The chip 1 is gastightly sealed in the dry air atmosphere gas in the package. Since the gas 5 is as dry air, the deterioration can be improved without rising a dew point. |
| 公开日期 | 1992-02-04 |
| 申请日期 | 1984-03-05 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70556]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NIPPON DENSHIN DENWA KK |
| 推荐引用方式 GB/T 7714 | FUKUDA MITSUO,HIGUCHI HIDEYO,NAMISAKI HIROBUMI,et al. -. JP1992006114B2. 1992-02-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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