中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Manufacture of semiconductor element

文献类型:专利

作者HAYASHI SHOJI; SATO AKIHIKO
发表日期1986-02-10
专利号JP1986029185A
著作权人HITACHI LTD
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor element
英文摘要PURPOSE:To scratch a light emitting end face by scribing slender chips in the state that the sides are not contacted. CONSTITUTION:A flexible resin sheet 9 is extended in a Y direction in the state that slender chips 3 having light emitting unit end faces 2 at both sides are bonded onto the sheet 9 to set the state that the interval (d) of the adjacent chips 3, 3 is spaced at 0.1mm. or longer. Then, the chip 3 is scratched at 10 by scribing only the portion at the center of a scribing area 4 of Y direction by a diamond cutter 5 to form a scratch 10. When this scratch 10 is triggered to crack the chip 3, the side 11 perpendicular to the light emitting end 2 is cleaved and divided, thereby obtaining a chip 6 having a light emitting end 7 including no scratch.
公开日期1986-02-10
申请日期1984-07-20
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/70577]  
专题半导体激光器专利数据库
作者单位HITACHI LTD
推荐引用方式
GB/T 7714
HAYASHI SHOJI,SATO AKIHIKO. Manufacture of semiconductor element. JP1986029185A. 1986-02-10.

入库方式: OAI收割

来源:西安光学精密机械研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。