Manufacture of semiconductor element
文献类型:专利
作者 | HAYASHI SHOJI; SATO AKIHIKO |
发表日期 | 1986-02-10 |
专利号 | JP1986029185A |
著作权人 | HITACHI LTD |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Manufacture of semiconductor element |
英文摘要 | PURPOSE:To scratch a light emitting end face by scribing slender chips in the state that the sides are not contacted. CONSTITUTION:A flexible resin sheet 9 is extended in a Y direction in the state that slender chips 3 having light emitting unit end faces 2 at both sides are bonded onto the sheet 9 to set the state that the interval (d) of the adjacent chips 3, 3 is spaced at 0.1mm. or longer. Then, the chip 3 is scratched at 10 by scribing only the portion at the center of a scribing area 4 of Y direction by a diamond cutter 5 to form a scratch 10. When this scratch 10 is triggered to crack the chip 3, the side 11 perpendicular to the light emitting end 2 is cleaved and divided, thereby obtaining a chip 6 having a light emitting end 7 including no scratch. |
公开日期 | 1986-02-10 |
申请日期 | 1984-07-20 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/70577] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | HITACHI LTD |
推荐引用方式 GB/T 7714 | HAYASHI SHOJI,SATO AKIHIKO. Manufacture of semiconductor element. JP1986029185A. 1986-02-10. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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