-
文献类型：专利
| 作者 | NAKADA NAOTARO; MUSHIGAMI MASAHITO; ISHIDA JUJI; FUKADA HAYAMIZU; TANAKA HARUO |
| 发表日期 | 1992-12-03 |
| 专利号 | JP1992076238B2 |
| 著作权人 | ROHM KK |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | - |
| 英文摘要 | PURPOSE:To set a die-bonding position accurately, by applying a laser light to the front end face of a luminant semiconductor chip along an axial line passing through a fixed point for reference of a stem, and by moving, on the other hand, the semiconductor chip to a position at which the output of a monitoring photodiode is maximum. CONSTITUTION:A laser light of a wavelength not involving the absorption by an active layer 4a is applied to the front end face of a luminant semiconductor chip 4 from a position-setting semiconductor laser 13, while the semiconductor chip 4 put on the top of a block 3 is absorbed by a vacuum chuck capillary 11 and moved in the vertical and horizontal ddirections with respect to an axial line C. When a luminant portion 4a' in the active layer 4a of the semiconductor chip 4 coincides with the axial line C passing through a fixed point 0 for reference of a stem 2, the laser light is transmitted to a monitoring photodiode 8 through the luminant portion 4a', and thus an output detector 12 detects an maximum output. By moving the semiconductor chip 4 to the position to which the output detector 12 detects the maximum output, therefore, a die- bonding position can beset accurately. |
| 公开日期 | 1992-12-03 |
| 申请日期 | 1985-01-29 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70619]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM KK |
| 推荐引用方式 GB/T 7714 | NAKADA NAOTARO,MUSHIGAMI MASAHITO,ISHIDA JUJI,et al. -. JP1992076238B2. 1992-12-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。