Setting method of die-bonding position of semiconductor chip for electronic component
文献类型：专利
| 作者 | NAKADA NAOTARO; MUSHIGAMI MASAHITO; ISHIDA YUUJI; FUKADA HAYAMIZU; TANAKA HARUO |
| 发表日期 | 1986-08-06 |
| 专利号 | JP1986174689A |
| 著作权人 | ROHM CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Setting method of die-bonding position of semiconductor chip for electronic component |
| 英文摘要 | PURPOSE:To set the position of a semiconductor chip accurately and rapidly, by applying a laser light to the end face of the semiconductor chip through an optical chopper and convergent lenses, and by moving the semiconductor chip to a position at which the maximum output of a monitoring photodiode terminal is detected by an output detector. CONSTITUTION:A laser light emitted from a position setting semiconductor laser 12 is applied, at an interval of intermittence given by an optical chopper 18, to the luminant end face of a semiconductor chip 4 located on the top of a block 3, through convergent lenses 13 and 14. Then the semiconductor chip 4 is adsorbed by a vacuum chuck capillary 11 and moved forward and backward. When the luminant end face approaches the focus F, a reflected laser light returns to the semiconductor laser 12 and thereby the output of a monitoring photodiode terminal 12c is varied. While the reflected laser light is modulated into pulses by the intermittence by the optical chopper 18, the peak value thereof is picked up by a peak-to-peak detection circuit 16, and the semiconductor chip 4 is moved to a position at which an output indicated by an output detector 17 is maximum. By this method, a die-bonding position can be set at a position located at a prescribed distance L. |
| 公开日期 | 1986-08-06 |
| 申请日期 | 1985-01-29 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70620]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM CO LTD |
| 推荐引用方式 GB/T 7714 | NAKADA NAOTARO,MUSHIGAMI MASAHITO,ISHIDA YUUJI,et al. Setting method of die-bonding position of semiconductor chip for electronic component. JP1986174689A. 1986-08-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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