Chip carrier
文献类型：专利
| 作者 | YAMASHITA JUNICHIRO; MIYAKE YOSHIO; TAKEI TOSHIO |
| 发表日期 | 1986-08-16 |
| 专利号 | JP1986183978A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Chip carrier |
| 英文摘要 | PURPOSE:To prevent the deterioration in quality caused by the solder heat of a light emitting element or the axial shift of an optical fiber after soldering by a method wherein the part holding the optical fiber is composed of heat insulator. CONSTITUTION:In the fusion state of solder 7, while an optical fiber 6 is moved, the coupling degree of the radiated light out of a light emitting element 5 with it is monitored. In the state of holding the fiber 6 at a position where the coupling degree becomes maximum, the solder 7 is solidified by cooling. In this case, a heat insulator 3A is exposed to solder heat for its fusion; however, this heat is shielded by the heat insulator 3A and does not transmit to the joint of a chip carrier 1A. This prevents the light emitting element 5 on a mount 2 of the chip carrier 1A from exposure to the solder heat. Since the temperature variation of the joint 4 as the carrier 1A main body reduces, the distorsion of this main body after cooling solidification of the solder 7 hardly generates. |
| 公开日期 | 1986-08-16 |
| 申请日期 | 1985-02-12 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70623]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | YAMASHITA JUNICHIRO,MIYAKE YOSHIO,TAKEI TOSHIO. Chip carrier. JP1986183978A. 1986-08-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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