Manufacture of semiconductor laser element
文献类型：专利
| 作者 | OGAWA HIROSHI; KAWAI YOSHIO; MATOBA AKIHIRO; KOBAYASHI MASAO |
| 发表日期 | 1987-11-25 |
| 专利号 | JP1987271483A |
| 著作权人 | OKI ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Manufacture of semiconductor laser element |
| 英文摘要 | PURPOSE:To improve the precision of the position of assembly, and to enhance heat-dissipating properties by bonding a semiconductor laser so as to be fitted to a heat sink. CONSTITUTION:Sections except a light-emitting section 21a for a semiconductor laser 21 are etched and removed, and sections except the upper surface of the projecting section 21a are irradiated by protons to form a high resistance layer 22. Electrodes 23a, 23b are shaped. A groove 24a to which the projecting section 21a is inserted is formed to a heat sink 24 consisting of Si or the like through potoetching, and the groove 24a and the projecting section 21a are fitted and bonded by solder 25. Consequently, the laser 21 can be assembled with the positional precision of a photoetching technique. The heat of the light- emitting section 21a can be dissipated efficiently to the heat sink 24. |
| 公开日期 | 1987-11-25 |
| 申请日期 | 1986-05-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70701]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OKI ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | OGAWA HIROSHI,KAWAI YOSHIO,MATOBA AKIHIRO,et al. Manufacture of semiconductor laser element. JP1987271483A. 1987-11-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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