Semiconductor light-emitting device
文献类型：专利
| 作者 | YAMAMOTO YOUSUKE; HATTORI AKIRA |
| 发表日期 | 1988-04-26 |
| 专利号 | JP1988095691A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor light-emitting device |
| 英文摘要 | PURPOSE:To remove the defective assembly of a short circuit, etc., and to dissipate heat generation in a light-emitting section efficiently by bonding a semiconductor laser chip with a heat sink on the light-emitting section side main surface of the chip and on the reverse side main surface and mounting a radiator plate onto the light-emitting section side main surface, in contact with the surface of the heat sink. CONSTITUTION:The greater part of heat generated in a light-emitting section 2 pass through an upper ohmic electrode, and transmitted over a heat sink 3 through a radiator plate 4 consisting of a conductive material such as Mo, one part of residual heat escapes into air, and the other passes in a semiconductor laser chip 1 and flows through the heat sink 3 in a lower section, thus effectively dissipating the heat generation of the light-emitting section to the outside. A defective short-circuit on assembly can be removed by assembling the title device through a junction up method. |
| 公开日期 | 1988-04-26 |
| 申请日期 | 1986-10-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70731]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | YAMAMOTO YOUSUKE,HATTORI AKIRA. Semiconductor light-emitting device. JP1988095691A. 1988-04-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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