Optical semiconductor device
文献类型：专利
| 作者 | NAKAYAMA TAKAYUKI; KINOSHITA YOSHINORI |
| 发表日期 | 1988-06-29 |
| 专利号 | JP1988156387A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical semiconductor device |
| 英文摘要 | PURPOSE:To reduce the using amount of a bonding material and to suppress the effect of change with time on the solidified bonding material, by tapering a pipe, through which a piece of optical fiber is guided out of a case so that the tip faces a light emitting element, in the inside of the case, and fixing the optical fiber at this place with the metallic bonding material. CONSTITUTION:A pipe 21 penetrates through a side wall 3a of the main body 3 of a case in correspondence with a pipe 9. The diameter D1 of the protruding part of the pipe 21 at the outside of the case is the same as that of the pipe 9. The protruding part of the pipe in the case comprises a tapered part 21a and a small-diameter part 21b. The inside of the small-diameter part 21b is filled with a solder 22 as a metallic bonding material so as to surround a piece of optical fiber 14. Thus the airtightness of the lead-out part of the optical fiber is secured. The amount of the solder 22 is very smaller than the amount in a conventional device. A thickness t1 of the solder surrounding the optical fiber 14 in the direction of the diameter of the pipe is an thin as a fraction of the conventional device. Therefore, the deviating amount of the optical fiber 14 due to the change with time of the solder 22 such as segregation creep and the like is suppressed to a lower value. The effect to the fixed part of the tip of the optical fiber is suppressed, and the initial characteristics can be maintained for a long period. |
| 公开日期 | 1988-06-29 |
| 申请日期 | 1986-12-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70742]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | NAKAYAMA TAKAYUKI,KINOSHITA YOSHINORI. Optical semiconductor device. JP1988156387A. 1988-06-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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