Heat sink
文献类型：专利
| 作者 | NEGISHI HIDEHIKO; ABE TOMOKO |
| 发表日期 | 1988-07-26 |
| 专利号 | JP1988181491A |
| 著作权人 | MATSUSHITA ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat sink |
| 英文摘要 | PURPOSE:To obtain a stable metal fixing of a semiconductor laser and to allow monitor light of a semiconductor laser element to be connected to a photodetector with high efficiency by causing the semiconductor laser element to form a metallic layer having a high thermal conductivity at its whole plane and further to prepare an inclined part at its fixed plane. CONSTITUTION:After Ti and Ni are deposited at the whole plane of a heat sink 11, a soldering plating is performed and then a semiconductor laser element 13 is fixed to a heat sink with metal (solder). There is an inclined part 12 at a fixed plane of the laser element 13 having the heat sink 1 Monitor light in the rear of the laser element 13 is not reflected to the heat sink 11 and is taken out in the rear. If only an angle of inclination theta at the inclined part 12 of the heat sink 11 is more than 15 deg., the monitor light will be favorably connected to a photodetector. Although the whole plane of the heat sink 11 is treated by solder plating, it may be as well to be treated at more than three faces such as upper, lower, and side faces. Thus a stable metal fixing of the semiconductor laser element is obtained and the monitor light in the rear of the laser element is connected to the photodetector with high efficiency. |
| 公开日期 | 1988-07-26 |
| 申请日期 | 1987-01-23 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70749]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | NEGISHI HIDEHIKO,ABE TOMOKO. Heat sink. JP1988181491A. 1988-07-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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