Semiconductor laser device
文献类型：专利
| 作者 | YOSHIKAWA NORIYUKI; YOSHIKAWA AKIO; ITO KUNIO |
| 发表日期 | 1988-08-18 |
| 专利号 | JP1988200590A |
| 著作权人 | MATSUSHITA ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser device |
| 英文摘要 | PURPOSE:To reduce the size and the number of steps, to shorten wirings and to enhance the frequency of a semiconductor laser device by bonding a semiconductor laser chip on a semiconductor integrated circuit, thereby eliminating a silicon submount. CONSTITUTION:A semiconductor laser bonding part 7 is formed on an electronic circuit chip 3, and tin is deposited only on a part equal to the chip area of a semiconductor laser An integrated photodetector 8 is formed on the chip 3, and the photodetector 8 of relatively large area is provided at the rear of the part 7. Accordingly, the outgoing beam of the laser 1 rearward is photodetected to obtain a monitoring output. |
| 公开日期 | 1988-08-18 |
| 申请日期 | 1987-02-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70753]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | YOSHIKAWA NORIYUKI,YOSHIKAWA AKIO,ITO KUNIO. Semiconductor laser device. JP1988200590A. 1988-08-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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