Semiconductor device
文献类型：专利
| 作者 | HIROKAWA KATSUTO |
| 发表日期 | 1988-11-09 |
| 专利号 | JP1988271988A |
| 著作权人 | FUJITSU LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor device |
| 英文摘要 | PURPOSE:To improve the airtightness, the fixing accuracy, and the mechanical strength of fixing places by causing a fixed structure part to have a structure where two metal frames are piled up with respective surfaces spread with solder and there is adhesive bonding between two metal frames and a stem as well as a holder with lenses. CONSTITUTION:As there is adhesive bonding by using a metallic adhesive material 7 between the first and second metal frames 21 and 22 and a stem 1 as well as a holder 3 with lenses, while the above two frames are bonded by the metallic adhesive material 7 in a state where both frames are piled up each other, a fixed structure part is not only superior in airtightness but also has enough mechanical strength. A frame body 23 made of metallic adhesive material is efficiently heated from up and down faces with the aid of the first and second metallic frames 21 and 22 which are treated by high-frequency induction heating and then, is uniformly molten all around in a short time. As a result, only an extremely short time is required to perform its high-frequency induction treatment so as to avoid unnecessary excessive heat- treatment of a semiconductor element. As the above frame 23 is molten at a uniform rate all around, its setting also progresses in a uniform manner all around and no lateral displacement of the stem develops in the case of the above setting. |
| 公开日期 | 1988-11-09 |
| 申请日期 | 1987-03-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70762]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LTD |
| 推荐引用方式 GB/T 7714 | HIROKAWA KATSUTO. Semiconductor device. JP1988271988A. 1988-11-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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