Semiconductor laser module
文献类型：专利
| 作者 | OSHIMA MASAAKI; HIRAYAMA NORIYUKI; IDOTA TAKESHI |
| 发表日期 | 1988-11-24 |
| 专利号 | JP1988287084A |
| 著作权人 | MATSUSHITA ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser module |
| 英文摘要 | PURPOSE:To improve reliability and coupling efficiency, by burying an optical fiber in a light taking-out part of a surface emitting type laser for directly coupling laser beam with the optical fiber. CONSTITUTION:A surface emitting type laser 2 is die-boneded on a stem 1 followed by die-bonding of the light-receiving surface of a monitor diode 3 and an outgoing window 4 of laser light together. Next, a core 5 of an optical fiber is put in the other outgoing window 6 of the laser 2 and a housing is soldered on the electrode surface 7 of a chip. Further, the electrode surface 7 is wire-bonded with a cathode lead 8, and the electrode surface of the monitor diode 3 is wire-bonded with a lead 9. Thereon a cap 11 is put to form a laser module. With this constitution, the coupling efficiency of laser beam and an optical fiber is as high as 40% on the average, having no tempera-ture fluctuation of light output of fiber and a monitor diode output, while improving reliability. |
| 公开日期 | 1988-11-24 |
| 申请日期 | 1987-05-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70779]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | OSHIMA MASAAKI,HIRAYAMA NORIYUKI,IDOTA TAKESHI. Semiconductor laser module. JP1988287084A. 1988-11-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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