Semiconductor laser device
文献类型：专利
| 作者 | YAMAWAKI TAKESHI; SHIMA AKIHIRO |
| 发表日期 | 1989-05-31 |
| 专利号 | JP1989138781A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser device |
| 英文摘要 | PURPOSE:To compensate easily the deviation of laser rays from an optical axis in an assembly process by a method wherein a heat sink provided with a face, which is obliquely cut to enable the bonded surface of the sink with a primary face of a stem not to form a right angle with a semiconductor laser mounting face, is employed. CONSTITUTION:A tapered block 6 is provided, where a submount 3 and a semiconductor laser chip 1 are mounted on a face of the block 6 which makes a oblique angle with the tapered face and the tapered face of the tapered block 6 is bonded to the primary face 4 of the stem 5 so as to make a light emitting point of the semiconductor laser chip 1 be situated at the center of the stem 5, so that laser rays can be taken out perpendicularly to the stem primary face 4 even if the laser chip 1, which does not emit laser rays in parallel with the bonded face of the semiconductor laser chip 1, is used. Therefore, the deviation of laser rays from an optical axis can be decreased and a device of this design can be improved in a coupling efficiency with an external optical system. So that, a semiconductor laser device can be decreased in a laser ray output, consequently in a heat release by operating it with small current, and improved in reliability. |
| 公开日期 | 1989-05-31 |
| 申请日期 | 1987-11-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70807]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | YAMAWAKI TAKESHI,SHIMA AKIHIRO. Semiconductor laser device. JP1989138781A. 1989-05-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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