Semiconductor laser package
文献类型：专利
| 作者 | AOYANAGI TOSHITAKA; NAGAI YUTAKA |
| 发表日期 | 1989-06-22 |
| 专利号 | JP1989160076A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser package |
| 英文摘要 | PURPOSE:To obtain a semiconductor laser package for allowing for cooling of liquid with improved cooling efficiency by providing a flowing hole of liquid for cooling and a mounting hole for fixing outside this flowing hole. CONSTITUTION:A semiconductor laser package mounting a semiconductor laser chip is connected to a liquid introduction and discharge pipe connection part 9 through an O ring 10 which was fit to a fitting groove 7 of packing such as an O ring and plural semiconductor laser packages are fixed so that they may be in one piece through a mounting screw 11 and a mounting nut 12 using a mounting hole 2. The liquid introduction and discharge pipe is connected to the liquid introduction and discharge connection 9 and a liquid for cooling 13 is allowed to flow. By cooling in this manner, a sufficient cooling can be made without leaking liquid to the outside. |
| 公开日期 | 1989-06-22 |
| 申请日期 | 1987-12-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70813]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | AOYANAGI TOSHITAKA,NAGAI YUTAKA. Semiconductor laser package. JP1989160076A. 1989-06-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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