Heat sink
文献类型：专利
| 作者 | NEGISHI HIDEHIKO; IMAMURA HIROKO |
| 发表日期 | 1990-01-25 |
| 专利号 | JP1990022878A |
| 著作权人 | MATSUSHITA ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat sink |
| 英文摘要 | PURPOSE:To obtain a heat sink which can efficiently couple a front beam from a semiconductor laser element with an optical system and a rear beam with a photodetector by a method wherein a protruding part used to fix the semiconductor laser element is formed and a metal layer is formed on the surface of the protruding part in order to fix the element stably. CONSTITUTION:A heat sink 11 is composed of silicon whose resistance is low and whose thermal conductivity is high; a protruding part 12 used to fix a semiconductor laser element is formed on its surface. This protruding part 12 is formed accurately and, with high accuracy by a photoetching operation. In addition, Ti and Ni are evaporated on the whole surface of the protruding part 12; after that, a solder is plated and a metal layer 13 is formed. A semiconductor laser element 14 is positioned and fixed to the protruding part 12 by using the solder-plated metal layer 13. In addition, a height of the protruding part 12 is decided by measuring a far field pattern of the semiconductor laser element 14; when the height is mum or higher by an experiment, good coupling between a front beam 18 and an optical lens 20 as well as between a rear beam 19 and a photodetector 22 can be obtained. |
| 公开日期 | 1990-01-25 |
| 申请日期 | 1988-07-12 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70857]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | NEGISHI HIDEHIKO,IMAMURA HIROKO. Heat sink. JP1990022878A. 1990-01-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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