Optoelectronic device
文献类型：专利
| 作者 | TAKIZAWA YASUSHI; SASAYAMA ATSUSHI |
| 发表日期 | 1990-03-27 |
| 专利号 | JP1990086184A |
| 著作权人 | HITACHI LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Optoelectronic device |
| 英文摘要 | PURPOSE:To secure a sufficient bonding strength so as to cope with an optical element having a plurality of light emitting sections by performing wire bonding through the optical element and a conductive layer extended on the surface of an insulating material formed almost in parallel with the bonding surface of external pin leads. CONSTITUTION:A stem 3 mounted with external pin leads 9d, 9b, and 9c at prescribed positions with glass and by welding is prepared and a heat sink 4 and insulating body 6 are fitted to the stem 3 with a sliver brazing material. Then a photodiode 2 is fitted to the surface of the stem 3 by soldering, etc., and a laser diode 1 is fitted to the side face of the heat sink 4 with silver paste, solder, etc. After fitting the diodes 1 and 2, the diode 2 is connected with the pin lead 9c and a gold layer 5b formed on the insulating body 6 is also connected with the pin leads by wire bonding. Then the gold layer 5a is connected with the laser diode 1 by wire bonding while the steam 3 is tilted so that the layer 5a and diode 1 can be faced to the surface where the wire bonding is performed previously. |
| 公开日期 | 1990-03-27 |
| 申请日期 | 1988-09-22 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70870]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HITACHI LTD |
| 推荐引用方式 GB/T 7714 | TAKIZAWA YASUSHI,SASAYAMA ATSUSHI. Optoelectronic device. JP1990086184A. 1990-03-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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