Semiconductor device
文献类型：专利
| 作者 | ITO KIYOSHI |
| 发表日期 | 1990-10-05 |
| 专利号 | JP1990249256A |
| 著作权人 | NEC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor device |
| 英文摘要 | PURPOSE:To absorb an instantaneous surge voltage generated by a human body, production equipment, etc., and protect a semiconductor chip from application of a high voltage by a method wherein the bottom electrode of the semiconductor chip is mounted on a dielectric heatsink attached to a mounting post and the heatsink is provided electrically in parallel with the semiconductor chip. CONSTITUTION:A package 4 which has a first lead 4c jointed to the bottom of a conductive base 4b, a second lead 4d which is inserted into a through-hole drilled in the base 4b and isolated from and fixed to the base 4b with insulating sealing glass 7 and a mounting post 4a provided on the base 4b, a dielectric heatsink 2 attached to the mounting post 4a, a conductor layer 3a provided on the surface of the heatsink 2 opposite to the mounting post 4a, a semiconductor chip 1 whose bottom electrode is mounted on the conductor layer 2a, a first bonding wire 3a with which the upper electrode of the semiconductor chip 1 is connected to the mounting post 4a and a second bonding wire 3b with which the conductor layer 2a is connected to the second lead 4d are provided. |
| 公开日期 | 1990-10-05 |
| 申请日期 | 1988-11-02 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/70881]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORP |
| 推荐引用方式 GB/T 7714 | ITO KIYOSHI. Semiconductor device. JP1990249256A. 1990-10-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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