Hybrid integrated circuit device
文献类型：专利
| 作者 | SHIMIZU, HISASHI; SAKAMOTO, NORIAKI; KOBAYASHI, YOSHIYUKI |
| 发表日期 | 2004-05-04 |
| 专利号 | US6730933 |
| 著作权人 | III HOLDINGS 2, LLC |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Hybrid integrated circuit device |
| 英文摘要 | In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency, reduction of the size and weight, and prevention of temporal changes are realized.A Cu pattern covered with Ni is formed on a metal substrate 1 Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved.A transparent substrate 50 is bonded via a seal 51, and temporal changes of a light emitting element 10 and electrodes which are sealed therein are suppressed. |
| 公开日期 | 2004-05-04 |
| 申请日期 | 2000-03-28 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/72021]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | III HOLDINGS 2, LLC |
| 推荐引用方式 GB/T 7714 | SHIMIZU, HISASHI,SAKAMOTO, NORIAKI,KOBAYASHI, YOSHIYUKI. Hybrid integrated circuit device. US6730933. 2004-05-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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