Light emitting device package
文献类型：专利
| 作者 | LEE, TAE SUNG; KIM, WON JUNG; SONG, JUNE O; LIM, CHANG MAN |
| 发表日期 | 2019-02-27 |
| 专利号 | EP3439050A3 |
| 著作权人 | LG INNOTEK CO. LTD |
| 国家 | 欧洲专利局 |
| 文献子类 | 发明申请 |
| 其他题名 | Light emitting device package |
| 英文摘要 | A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess. |
| 公开日期 | 2019-02-27 |
| 申请日期 | 2018-07-27 |
| 状态 | 申请中 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/72339]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LG INNOTEK CO. LTD |
| 推荐引用方式 GB/T 7714 | LEE, TAE SUNG,KIM, WON JUNG,SONG, JUNE O,et al. Light emitting device package. EP3439050A3. 2019-02-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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