Semiconductor laser device
文献类型：专利
| 作者 | MIYAHARA HIROYUKI; IMAI YUJI; TSUBOI KUNIO |
| 发表日期 | 1990-08-21 |
| 专利号 | JP1990209786A |
| 著作权人 | SONY CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser device |
| 英文摘要 | PURPOSE:To prevent a sealing resin from being discolored by the heat generated by a laser chip and the laser chip from being damaged by the thermal stress, by coating the laser chip with a heat-resistant resin. CONSTITUTION:The surface of a laser chip 4 is coated with silicone 9 being a heat-resistant resin, and its film thickness is 6mum or more. A transparent sealing resin 10 of epoxy resin seals the laser chip 4, a submount 2, the submount bond area of a board 1, and the areas of leads 5, 6 connected with the connecting wires 7, 8. This sealing may be performed either by die-molding such as compression molding, potting, etc., or without the use of a metallic mold. As the heat-resistant resin 9 made of silicone is interposed between the laser chip 4 and epoxy resin 10 being a sealing resin, in this way, the influence by the heat generated by the laser chip 4 on the epoxy resin 10 is reduced. |
| 公开日期 | 1990-08-21 |
| 申请日期 | 1989-02-09 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/76013]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORP |
| 推荐引用方式 GB/T 7714 | MIYAHARA HIROYUKI,IMAI YUJI,TSUBOI KUNIO. Semiconductor laser device. JP1990209786A. 1990-08-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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