Manufacture of semiconductor laser
文献类型:专利
作者 | TAKAGI NOBUYUKI |
发表日期 | 1984-06-30 |
专利号 | JP1984113677A |
著作权人 | FUJITSU KK |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Manufacture of semiconductor laser |
英文摘要 | PURPOSE:To contrive not to generate more sags than have been prescribed at the angle part of the meltback layer by a method wherein a second semiconductor layer is etched so as to have an angle of 70-90 deg. to the surface of a semiconductor and a first semiconductor layer is etched for forming a groove to reach up to the semiconductor substrate. CONSTITUTION:A P type Ga1-xAlxAs current obstructing layer 12 is grown on a silicon doped N type GaAs substrate 11 by a liquid-phase epitaxial growth method and on the layer 12 is arranged an N type GaAs layer 13 by a liquid- phase growth method, for example. Then, a groove 15 is formed by performing a wet etching using an SiO2 film 14 as the mask. The shape of the groove, which is formed by this etching, is formed in such a condition that the angle alpha, which is made by the etched surface 13a of the N type GaAs substrate 13 and a 100 face, is 70-90 deg. On the other hand, the P type Ga1-xAlxAs current obstructing layer 13 and the etched surface 11a of the N type GaAs substrate 11 are a 111 face and the angle beta, which is formed by the 111 face and the 100 face, becomes 52.24 deg. After the SiO2 film 14 was removed, a Ga1-xAlx As layer 16 is formed on the GaAs substrate 13 and the groove 15 by a liquid- phase epitaxial growth. |
公开日期 | 1984-06-30 |
申请日期 | 1982-12-21 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/77378] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | FUJITSU KK |
推荐引用方式 GB/T 7714 | TAKAGI NOBUYUKI. Manufacture of semiconductor laser. JP1984113677A. 1984-06-30. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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