Package for semiconductor laser
文献类型：专利
| 作者 | SHINKAI JIRO |
| 发表日期 | 1992-10-12 |
| 专利号 | JP1992286179A |
| 著作权人 | SUMITOMO ELECTRIC IND LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Package for semiconductor laser |
| 英文摘要 | PURPOSE:To improve the efficiency of heat dissipation by mounting a fin to the external surface of a can sealing a chip while coating the fin in black. CONSTITUTION:A can 4a with a window 6, through which laser beams emitted from a semiconductor laser 1 are transmitted, seals a header 3, the semiconductor laser 1 loaded on the heater 3 and a heat sink 2. A plurality or radially arrayed tabular fins 7 are installed on the side face of the can 4a while the surfaces of the can 4a and the fins 7 are coated in black with the exception of the window 6. Accordingly, heat generated at a time when the semiconductor laser 1 is operated is propagated successively to the heat sink 2 and the can 4a, and dissipated efficiently from the fins 7. |
| 公开日期 | 1992-10-12 |
| 申请日期 | 1991-03-14 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/77910]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC IND LTD |
| 推荐引用方式 GB/T 7714 | SHINKAI JIRO. Package for semiconductor laser. JP1992286179A. 1992-10-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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