Semiconductor laser device
文献类型：专利
| 作者 | WADA MASARU; ITO KUNIO |
| 发表日期 | 1989-10-12 |
| 专利号 | JP1989256188A |
| 著作权人 | 松下電器産業株式会社 |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser device |
| 英文摘要 | PURPOSE:To realize cost reduction by fixing an Si submount bonded with a laser chip on a metal lead frame and by sealing it with a transparent molding resin. CONSTITUTION:An Si submount 4 which is provided with a photodiode 2 and a laser chip 3 is fixed to one tip section of an external lead 1, and the remaining external leads are connected to the electrode of the photodiode 2 and the laser chip 3, respectively with a metal fine line. An assembly structure made in this way is sealed with transparent resin 5. Since the transparent resin 5 is prevented from entering a section of a recessed area 16 formed near an active region due to a surface tension thereof, the interior of the area 16 is hollow. Because the same material and process as an ordinary resin sealed semiconductor device can be used for this manufacture, cost reduction can be realized. |
| 公开日期 | 1989-10-12 |
| 申请日期 | 1988-04-06 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/78600]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 松下電器産業株式会社 |
| 推荐引用方式 GB/T 7714 | WADA MASARU,ITO KUNIO. Semiconductor laser device. JP1989256188A. 1989-10-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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