Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints
文献类型：期刊论文
| 作者 | Wang, Z.; Zhang, Q. K.; Chen, Y. X.; Song, Z. L. |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2019 |
| 卷号 | 30期号:20页码:18524-18538 |
| 关键词 | MECHANICAL-PROPERTIES INTERFACIAL EMBRITTLEMENT TENSILE PROPERTIES SEGREGATION MICROSTRUCTURE TEMPERATURE SUBSTRATE BISMUTH BEHAVIOR GROWTH |
| DOI | 10.1007/s10854-019-02206-y |
| 英文摘要 | Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/17938]  |
| 专题 | 2019专题 |
| 作者单位 | Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Marine Mat & Protect Technol, Key Lab Marine Mat & Related Technol, Ningbo 315201, Zhejiang, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Z.,Zhang, Q. K.,Chen, Y. X.,et al. Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(20):18524-18538. |
| APA | Wang, Z.,Zhang, Q. K.,Chen, Y. X.,&Song, Z. L..(2019).Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(20),18524-18538. |
| MLA | Wang, Z.,et al."Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.20(2019):18524-18538. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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