Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating
文献类型：期刊论文
| 作者 | Wang, Xu; Zhang, Shengtao; Chen, Shijin; Tan, Bochuan; Guo, Hailiang; Wang, Ya; Qiang, Yujie; Fu, Shulei; Wen, Yanan |
| 刊名 | JOURNAL OF THE ELECTROCHEMICAL SOCIETY
 |
| 出版日期 | 2019 |
| 卷号 | 166期号:13页码:D660-D668 |
| 关键词 | SELF-ASSEMBLED MONOLAYER CORROSION-INHIBITORS SULFURIC-ACID IONIC LIQUIDS CHLORIDE ELECTRODEPOSITION DERIVATIVES ADSORPTION MECHANISM SODIUM |
| DOI | 10.1149/2.0461913jes |
| 英文摘要 | Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/17989]  |
| 专题 | 2019专题 |
| 作者单位 | Zhang, ST (reprint author), Chongqing Univ, Sch Chem & Chem Engn, Chongqing 400044, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Wang, Xu,Zhang, Shengtao,Chen, Shijin,et al. Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2019,166(13):D660-D668. |
| APA | Wang, Xu.,Zhang, Shengtao.,Chen, Shijin.,Tan, Bochuan.,Guo, Hailiang.,...&Wen, Yanan.(2019).Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating.JOURNAL OF THE ELECTROCHEMICAL SOCIETY,166(13),D660-D668. |
| MLA | Wang, Xu,et al."Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating".JOURNAL OF THE ELECTROCHEMICAL SOCIETY 166.13(2019):D660-D668. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。