Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''
文献类型：期刊论文
| 作者 | Wang, Da-Wei; Chen, Wenchao; Zhao, Wen-Sheng; Zhu, Guo-Dong; Kang, Kai; Gao, Pingqi; Schutt-Aine, Jose E.; Yin, Wen-Yan |
| 刊名 | IEEE ACCESS
 |
| 出版日期 | 2019 |
| 卷号 | 7页码:3897-3908 |
| 关键词 | RANDOM-ACCESS MEMORY RESISTIVE MEMORY INTEGRATION BEHAVIOR DIAMOND ZN4SB3 MODEL |
| DOI | 10.1109/ACCESS.2018.2888572 |
| 英文摘要 | Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House'' |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/18672]  |
| 专题 | 2019专题 |
| 作者单位 | 1.Zhao, WS (reprint author), Hangzhou Dianzi Univ, Sch Elect & Informat, Hangzhou 310018, Zhejiang, Peoples R China. 2.Chen, WC (reprint author), Zhejiang Univ, ZJU LTIUC Inst, Int Campus, Haining 314400, Peoples R China. 3.Yin, WY (reprint author), Zhejiang Univ, Innovat Inst Electromagnet Informat & Elect Integ, Coll Informat Sci & Elect Engn, Key Lab Adv Micronano Elect Devices & Smart Syst, Hangzhou 310058, Zhejiang, Peoples R China. 4.Chen, WC |
| 推荐引用方式 GB/T 7714 | Wang, Da-Wei,Chen, Wenchao,Zhao, Wen-Sheng,et al. Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''[J]. IEEE ACCESS,2019,7:3897-3908. |
| APA | Wang, Da-Wei.,Chen, Wenchao.,Zhao, Wen-Sheng.,Zhu, Guo-Dong.,Kang, Kai.,...&Yin, Wen-Yan.(2019).Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''.IEEE ACCESS,7,3897-3908. |
| MLA | Wang, Da-Wei,et al."Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''".IEEE ACCESS 7(2019):3897-3908. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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