Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics
文献类型：期刊论文
| 作者 | Lian, PF; Song, JL; Lei, SW; Tao, ZC; Zhao, HC; Zhang, JP; Liu, ZJ |
| 刊名 | NEW CARBON MATERIALS
 |
| 出版日期 | 2018 |
| 卷号 | 33期号:4页码:351-356 |
| 关键词 | ENERGY STORAGE COPPER |
| ISSN号 | 1007-8827 |
| DOI | 10.1016/S1872-5805(18)60344-0 |
| 文献子类 | 期刊论文 |
| 英文摘要 | Two mesophase pitch-based graphite foams with densities of 0. 62 +/- 0. 01 ( GFI ) and 0. 84 +/- 0. 01 g/cm(3)( GF2) were prepared by foaming the pitch in an autoclave at 723 K, 6. 0 MPa and 763 K, 13. 4 MPa, respectively, followed by carbonization at 1273 K for 2 h and graphitization at 2973 K for 0.5 h. The GFs were infiltrated by a Sn-Bi liquid to prepare GF/Sn-Bi alloy composites for use as thermal sinks for electronics. The microstructures and thermophysical properties of the composites were investigated. Results indicated that GFI had a larger cells and thinner cell walls than GF2. The Sn-Bi liquid was well infiltrated into cells of the GFs, resulting in composites with densities of 5. 60 +/- 0. 01 and 3. 83 +/- 0. 01 g/cm(3) for GFI and GF2, respectively. The thermal diffusivity and coefficient of thermal expansion (CTE) of the GFI/Sn-Bi composite were 51.6 +/- 2 mm(2)/s and 16. 6 +/- 0. 02 ppm/K, respectively. The corresponding values for the GF2/Sn-Bi were 163. 1 +/- 3 mm(2)/s and 8. 08 +/- 0. 02 ppm/K. The GF2/Sn-Bi composite had a high thermal diffusivity and a low CTE value matching that of semiconductor chips and packaging materials. |
| 语种 | 英语 |
| 源URL | [http://ir.sinap.ac.cn/handle/331007/31032]  |
| 专题 | 上海应用物理研究所_中科院上海应用物理研究所2011-2017年 |
| 作者单位 | 1.Chinese Acad Sci, Inst Coal Chem, Key Lab Carbon Mat, Taiyuan 030001, Shanxi, Peoples R China 2.Chinese Acad Sci, Shanghai Inst Appl Phys, Key Lab Nucl Radiat & Nucl Energy Technol, Shanghai 201800, Peoples R China |
| 推荐引用方式 GB/T 7714 | Lian, PF,Song, JL,Lei, SW,et al. Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics[J]. NEW CARBON MATERIALS,2018,33(4):351-356. |
| APA | Lian, PF.,Song, JL.,Lei, SW.,Tao, ZC.,Zhao, HC.,...&Liu, ZJ.(2018).Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics.NEW CARBON MATERIALS,33(4),351-356. |
| MLA | Lian, PF,et al."Microstructure and thermophysical properties of graphite foam/Sn-Bi alloy composites for use as a thermal sink for electronics".NEW CARBON MATERIALS 33.4(2018):351-356. |
入库方式： OAI收割
来源：上海应用物理研究所
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