Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding
文献类型:期刊论文
作者 | Wu, Xishi; Pei, Bingbing; Zhu, Yunzhou; Huang, Zhengren |
刊名 | MATERIALS CHARACTERIZATION
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出版日期 | 2019-09-01 |
卷号 | 155 |
关键词 | C-f/SiC Reaction bonding Joint One-step Si infiltration |
ISSN号 | 1044-5803 |
DOI | 10.1016/j.matchar.2019.109799 |
文献子类 | Article |
英文摘要 | An improved joining technique by reaction bonded technology was studied. The final densification and joining of the reaction-sintered composites were simultaneously completed in the reaction bonding process by one-step Si infiltration process. This method achieves joints with strong interfacial bonding and high flexural strength. The joint obtained by the one-step silicon infiltration reaction has a more uniform microstructure, the joint flexural strength is increased to 203 MPa, and retention rate of the flexural strength is 96%, which is comparable to the flexural strength of the C-f/SiC substrate. The microstructure and interfacial evolution mechanism of the interlayer were discussed. The results show that a transition layer of 2-3 mu m transition layer formed between the interlayer and the C-f/SiC substrate, which is composed of SiC crystal grains of about 0.5-1 mu m. The formation of the transition layer is due to the carbon concentration difference at the interface between interlayer and substrate, resulting in the diffusion of carbon during the Si-C reaction. |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
语种 | 英语 |
出版者 | ELSEVIER SCIENCE INC |
源URL | [http://ir.sic.ac.cn/handle/331005/26870] ![]() |
专题 | 中国科学院上海硅酸盐研究所 |
推荐引用方式 GB/T 7714 | Wu, Xishi,Pei, Bingbing,Zhu, Yunzhou,et al. Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding[J]. MATERIALS CHARACTERIZATION,2019,155. |
APA | Wu, Xishi,Pei, Bingbing,Zhu, Yunzhou,&Huang, Zhengren.(2019).Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding.MATERIALS CHARACTERIZATION,155. |
MLA | Wu, Xishi,et al."Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding".MATERIALS CHARACTERIZATION 155(2019). |
入库方式: OAI收割
来源:上海硅酸盐研究所
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