In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device
文献类型：期刊论文
| 作者 | Yang, Yang; Fu, Zhengqian; Zhang, Xiao; Cui, Yan; Xu, Fangfang; Li, Tie; Wang, Yuelin |
| 刊名 | ULTRAMICROSCOPY
 |
| 出版日期 | 2019-03-01 |
| 卷号 | 198页码:43 |
| 关键词 | Double-tilt in situ TEM Tensile testing Mechanical characterization |
| ISSN号 | 0304-3991 |
| DOI | 10.1016/j.ultramic.2018.12.008 |
| 文献子类 | Article |
| 英文摘要 | This research is aimed at the development of an in situ tensile device which is suitable for standard double-tilt electrical TEM holders. The device contains a hexagonal electrostatic chip with a diameter of 1.8 mm. The chip has 706 pairs of combs, which provides an effective tensile displacement larger than 1 mu m To demonstrate the device performance, in situ tensile testing for penta-twinned silver nanowire is conducted in a high-resolution TEM. Experimental results show that the device can fulfill a flit angle of 10 degrees around both X and Y axes when performing in situ tensile testing experiments. The implemented tensile device has potential applications to characterize the deformation behavior of individual nanostructure in situ TEM at atomic lattice resolution level. |
| WOS研究方向 | Microscopy |
| 语种 | 英语 |
| 出版者 | ELSEVIER SCIENCE BV |
| 源URL | [http://ir.sic.ac.cn/handle/331005/27316]  |
| 专题 | 中国科学院上海硅酸盐研究所 |
| 推荐引用方式 GB/T 7714 | Yang, Yang,Fu, Zhengqian,Zhang, Xiao,et al. In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device[J]. ULTRAMICROSCOPY,2019,198:43. |
| APA | Yang, Yang.,Fu, Zhengqian.,Zhang, Xiao.,Cui, Yan.,Xu, Fangfang.,...&Wang, Yuelin.(2019).In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device.ULTRAMICROSCOPY,198,43. |
| MLA | Yang, Yang,et al."In situ TEM mechanical characterization of one-dimensional nanostructures via a standard double-tilt holder compatible MEMS device".ULTRAMICROSCOPY 198(2019):43. |
入库方式： OAI收割
来源：上海硅酸盐研究所
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