中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
首页 机构 成果 学者
  
  1. CAS IR Grid
  2. 过程工程研究所
  3. 中国科学院过程工程研究所
Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders

文献类型：期刊论文

作者Sun, Hong1,4; Guo, Lijiang4; Deng, Nan2,4; Li, Xiaoyu4; Li, Jiangtao3; He, Gang3; Li, Jianqiang1,4
刊名JOURNAL OF ALLOYS AND COMPOUNDS
出版日期2019-11-25
卷号810页码:7
关键词Metal matrix composites Electroplating Sintering Thermal conductivity
ISSN号0925-8388
DOI10.1016/j.jallcom.2019.151907
英文摘要Actuated by the needs of high power electronic devices heat dissipation, diamond/Cu composites with excellent thermal dissipation properties have been considered as the next generation of thermal management material. Herein, an easy-to-operate intermittently electroplated method is developed for coating micro-sized particles and successfully applied to prepare Cu-coated diamond powders for the first time. The Cu coating is covered evenly and densely on the diamond particles surface, and its volume fraction in diamond/Cu composite powders could be precisely controlled by adjusting the plating time. The dense diamond/Cu composites bulks with varied Cu volume fractions were obtained by hot-press sintering process. The as-sintered microstructures of diamond/Cu bulks present that diamond particles are bonded strongly by Cu shell layer, which is conducive to promoting densification capacity. The maximal diamond/Cu composite bulk possesses high thermal conductivity of 638 W/(m.K) and low coefficient of thermal expansion (CTE) of 4.11 x 10(-6)/K at 55 vol% diamond. The bending strength of 45 vol% diamond/Cu composite reaches 276 MPa. The combination of these excellent thermal and mechanical properties, coupled with the simple, efficient powder-preparation process, demonstrate the large potential of intermittently electroplated method applying in the development of thermal management material. (C) 2019 Elsevier B.V. All rights reserved.
WOS关键词METAL-MATRIX COMPOSITES ; COPPER/DIAMOND COMPOSITES ; CU/DIAMOND COMPOSITES ; INTERFACIAL DESIGN ; LAYER ; INFILTRATION ; OPTIMIZATION ; MANAGEMENT ; MICROSTRUCTURE ; PRETREATMENT
资助项目Strategic Priority Research Program of the Chinese Academy of Sciences[XDA15013500] ; National Natural Science Foundation of China[51501179]
WOS研究方向Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
语种英语
WOS记录号WOS:000486596000071
出版者ELSEVIER SCIENCE SA
资助机构Strategic Priority Research Program of the Chinese Academy of Sciences ; National Natural Science Foundation of China
源URL[http://ir.ipe.ac.cn/handle/122111/31013]  
专题中国科学院过程工程研究所
通讯作者Li, Jianqiang
作者单位1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
2.Univ Sci & Technol Beijing, Sch Mat Sci & Engn, Beijing 100083, Peoples R China
3.Chinese Acad Sci, Tech Inst Phys & Chem, Beijing 100190, Peoples R China
4.Chinese Acad Sci, Inst Proc Engn, CAS Key Lab Green Proc & Engn, Natl Engn Lab Hydromet Cleaner Prod Technol, Beijing 100190, Peoples R China
推荐引用方式
GB/T 7714		 Sun, Hong,Guo, Lijiang,Deng, Nan,et al. Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2019,810:7.
APA Sun, Hong.,Guo, Lijiang.,Deng, Nan.,Li, Xiaoyu.,Li, Jiangtao.,...&Li, Jianqiang.(2019).Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders.JOURNAL OF ALLOYS AND COMPOUNDS,810,7.
MLA Sun, Hong,et al."Elaborating highly thermal-conductive diamond/Cu composites by sintering intermittently electroplated core-shell powders".JOURNAL OF ALLOYS AND COMPOUNDS 810(2019):7.

入库方式： OAI收割

来源：过程工程研究所

浏览0
下载0
收藏0
其他版本

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。