Manufacture of optical integrated circuit
文献类型：专利
| 作者 | SUZAKI SHINZO |
| 发表日期 | 1990-05-31 |
| 专利号 | JP1990142194A |
| 著作权人 | FUJIKURA LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Manufacture of optical integrated circuit |
| 英文摘要 | PURPOSE:To facilitate cleavage and to improve a yield rate by forming grooves for insulating a part between current injecting regions and grooves for cleavage for cutting a wafer into one chip at the same time by etching. CONSTITUTION:At first, several hundred chips, each of which is composed of three current injecting regions A, B and C, are formed on a wafer. Then, grooves 20 for cleavage and grooves 21 for insulation are formed by wet etching or dry etching. The grooves 20 for cleavage are formed on both sides of a waveguide 20. The groove 20 comprises a longitudinal groove of width (x) and a lateral groove of width (z). The groove width (x) is approximately equal to the groove width (z). The insulating grooves 21 are formed on both sides of the waveguide 22. A width (y) of the groove 21 is made considerably narrower than the groove widths (x) and (z). When cracking is performed, cleavage occurs at the position of the grooves 20 for cleavage. The part of the three current injecting regions A, B and C which are surrounded with broken lines becomes one chip. The parts shown by thick lines 23 becomes the cleavage planes. Therefore, the cleavage does not occur at the insulating grooves 2 The cleavage is performed accurately at the grooves 20 for cleavage. |
| 公开日期 | 1990-05-31 |
| 申请日期 | 1988-11-22 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/83125]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJIKURA LTD |
| 推荐引用方式 GB/T 7714 | SUZAKI SHINZO. Manufacture of optical integrated circuit. JP1990142194A. 1990-05-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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