Submount for semiconductor laser element
文献类型：专利
| 作者 | USUKI TOSHIO |
| 发表日期 | 1992-12-07 |
| 专利号 | JP1992352377A |
| 著作权人 | MITSUBISHI ELECTRIC CORP |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Submount for semiconductor laser element |
| 英文摘要 | PURPOSE:To prevent a die-bonded solder from coming into contact with a junction part including an active region and blocking off a laser beam when a J/D is assembled in order to obtain a low heat resistance and a low drooping characteristic. CONSTITUTION:The face of a submount 3, on which a semiconductor laser chip 1 is mounted, is formed to be recessed and protruding shapes. It is possible to prevent an excess solder from flowing to recessed parts in the submount, coming into contact with a junction part in the semiconductor laser chip and blocking off a laser beam. |
| 公开日期 | 1992-12-07 |
| 申请日期 | 1991-05-29 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/83460]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORP |
| 推荐引用方式 GB/T 7714 | USUKI TOSHIO. Submount for semiconductor laser element. JP1992352377A. 1992-12-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。