Manufacture of semiconductor laser device
文献类型:专利
作者 | YAMASHITA KOJI; OKADA MASATO; HIRONAKA MISAO |
发表日期 | 1990-08-10 |
专利号 | JP1990202085A |
著作权人 | MITSUBISHI ELECTRIC CORP |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Manufacture of semiconductor laser device |
英文摘要 | PURPOSE:To protect the regrown interface against oxidation by a method wherein an etching stopper layer left at the etching of a current flow path groove is melted back, the surface of a clad layer at the groove is exposed when a cap layer is made to grow, and the cap layer and a contact layer are successively grown thereon. CONSTITUTION:An oxidation preventive GaAs layer 10 is left in thin film on the base of a current flow path 6 provided to a first conductivity type AlpGa1-pAs current block layer 11 which has been grown in a first epitaxial crystal growth process. When a second conductivity type AlzGa1-zAs cap layer 7 is grown without exposing a second conductivity type AlzGa1-zAs upper clad layer 4, only the oxidation preventive GaAs layer 10 is melted back to remove through a liquid phase epitaxial method. Thereafter, the second conductivity type AlzGa1-zAs cap layer 7 and a second conductivity type GaAs contact layer 8 are successively formed. By this setup, a regrown interface can be protected against oxidation. |
公开日期 | 1990-08-10 |
申请日期 | 1989-01-31 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/83914] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | MITSUBISHI ELECTRIC CORP |
推荐引用方式 GB/T 7714 | YAMASHITA KOJI,OKADA MASATO,HIRONAKA MISAO. Manufacture of semiconductor laser device. JP1990202085A. 1990-08-10. |
入库方式: OAI收割
来源:西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。