Optical interconnection circuit board and manufacturing method thereof
文献类型：专利
| 作者 | FURUYAMA, HIDETO |
| 发表日期 | 2005-10-13 |
| 专利号 | US20050226583A1 |
| 著作权人 | KABUSHIKI KAISHA TOSHIBA |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical interconnection circuit board and manufacturing method thereof |
| 英文摘要 | In an optical connection board, a first clad layer is formed on a flat surface of a substrate and a core layer is formed on the first clad layer and is extended in a propagation direction of an optical signal. The core layer is covered with a second clad layer. A termination mirror having a reflection face is so buried in the clad layer as to reflect the optical signal guided in the core layer, to the outside of the optical connection board. |
| 公开日期 | 2005-10-13 |
| 申请日期 | 2005-06-03 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/85032]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIBA |
| 推荐引用方式 GB/T 7714 | FURUYAMA, HIDETO. Optical interconnection circuit board and manufacturing method thereof. US20050226583A1. 2005-10-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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