Method of assembling vcsel chips on a sub-mount
文献类型：专利
| 作者 | PRUIJMBOOM, ARMAND; DUMOULIN, RAIMOND LOUIS; MILLER, MICHAEL |
| 发表日期 | 2014-11-27 |
| 专利号 | US20140348192A1 |
| 著作权人 | KONINKLIJKE PHILIPS ELECTRONICS N V |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Method of assembling vcsel chips on a sub-mount |
| 英文摘要 | The present invention relates to a method of assembling VCSEL chips (1) on a sub-mount (2). A de-wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub-mount (2). A further de-wetting layer (13) is deposited on a connecting side of the sub-mount (2) which is to be connected to the VCSEL chips (1). The de-wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub-mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub-mount (2) and soldered to the sub-mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub-mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub-mount (2) is achieved without time consuming measures. |
| 公开日期 | 2014-11-27 |
| 申请日期 | 2012-10-08 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/86182]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KONINKLIJKE PHILIPS ELECTRONICS N V |
| 推荐引用方式 GB/T 7714 | PRUIJMBOOM, ARMAND,DUMOULIN, RAIMOND LOUIS,MILLER, MICHAEL. Method of assembling vcsel chips on a sub-mount. US20140348192A1. 2014-11-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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