Assembling method for optical semiconductor device
文献类型:专利
作者 | HASEGAWA OSAMU |
发表日期 | 1988-01-23 |
专利号 | JP1988016684A |
著作权人 | FUJITSU LTD |
国家 | 日本 |
文献子类 | 发明申请 |
其他题名 | Assembling method for optical semiconductor device |
英文摘要 | PURPOSE:To maintain the positioning accuracy of a filter at the time of fixing the fiber by positioning the filter by moving a substrate disposed on an ultraviolet ray curable resin coated in advance on a body by a finely movable holder and then emitting an ultraviolet ray to cure the resin. CONSTITUTION:A filter 12 is secured in advance by an adhesive or a solder to a substrate 31 which is transparent for an ultraviolet ray. A body 17 contacted with the substrate 31 is coated with resin 32 cured with the ultraviolet ray to contact the substrate 31 held by a finely movable holder 21 with the resin 32. When the substrate 31 is finely moved so that the output from the fiber 12 becomes maximum to emit the ray to the substrate 31, the resin 32 under the substrate 31 is emitted by the ray since the substrate 31 is transparent for the ray. After the resin 32 is cured, the holder 21 is separated from the substrate. The surface which receives the ray of the substrate 31 is preferably formed flatly to prevent it from being arrived at the resin 32 due to the refraction of the ray. Thus, a stable semiconductor device can be assembled without applying heat at the time of curing the resin. |
公开日期 | 1988-01-23 |
申请日期 | 1986-07-09 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/86780] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | FUJITSU LTD |
推荐引用方式 GB/T 7714 | HASEGAWA OSAMU. Assembling method for optical semiconductor device. JP1988016684A. 1988-01-23. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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