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文献类型：专利
| 作者 | MAKIGUCHI SHIGEE; MITA ARIO; AKYAMA KATSUHIKO |
| 发表日期 | 1991-12-11 |
| 专利号 | JP1991077676B2 |
| 著作权人 | SONY CORP |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | - |
| 英文摘要 | PURPOSE:To improve workability by a method wherein a lattice of grooves is formed on a surface of an Si or Mo wafer, and a light-emitting element is fixed to a side of a region surrounded by grooves with the direction of light perpendicular to the direction of grooves and a fragment resulting from separation along the grooves is fixed tight to the assembly. CONSTITUTION:The anchoring surface of a 0.1mm.-thick, 0.2mm.X0.3mm.-large laser diode chip 6 is coated with an Au film. On one side of an Si wafer 1, grooves 2 are arranged lattice-wise that are as deep as half the Si wafer regions 3 surrounded with grooves 2 are covered with Sn 4 deposited by evaporation. Next, on a side of a region 3, a chip 6 is arranged with the direction of light 5 forming a right angle with the grooves 2. The product is then heated in N2 for the attachment of the chips 6 into the regions 3. The entirety is sectioned into fragments 7 for inspection. On the other hand, an assembly 10 wherein a radiator 9 is fixed to a header 8 is prepared, and the rear side of a fragment 7 is fixed by solder 4 to a side of the radiator 9. With the device being designed as such, the installation of a chip 6 onto a fragment 7 is performed correctly and easily, and the process of installing a chip 6 onto a wafer 1 can be accomplished in an automated manner, ensuring mass installation and improved workability. |
| 公开日期 | 1991-12-11 |
| 申请日期 | 1982-04-07 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/86897]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORP |
| 推荐引用方式 GB/T 7714 | MAKIGUCHI SHIGEE,MITA ARIO,AKYAMA KATSUHIKO. -. JP1991077676B2. 1991-12-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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