中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Manufacture of semiconductor device

文献类型:专利

作者UEDA OSAMU; TANAHASHI TOSHIYUKI
发表日期1984-02-27
专利号JP1984035432A
著作权人FUJITSU KK
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor device
英文摘要PURPOSE:To form a recessed groove without forming a bottom section to a mask by boring the mask film of a semiconductor base body in striped shape and irradiating ion beams at an angle of incidence selected to the main surface of the base body while executing a relative rotary motion around an axis vertical to the main surface. CONSTITUTION:An N-InP layer 2 and a P-InP layer 3 are superposed on an N- InP substrate 1, the layer 3 is coated with an SiO2 film 4, and the surface is bored 5 in the striped shape. The substrate 1 is fixed to a base 21, an angle theta formed by a base surface and ion beams 22 is set, and the opening is ion-etched while turning the substrate 1 at constant velocity according to the base 21 around the axis vertical to the base surface. The V-shaped groove 6' can be formed by selecting conditions. N-InP 7, an InGaAsP active layer 8, P-InP 9, P- InGaAsP 10 and electrodes 11, 12 are attached according to a conventional method, and a laser is completed. According to the constitution, the shape of the section of a recessed section is selected regardless of a crystal face and can be formed by selecting the angle of incidence and the speed of revolution of the base.
公开日期1984-02-27
申请日期1982-08-23
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/87360]  
专题半导体激光器专利数据库
作者单位FUJITSU KK
推荐引用方式
GB/T 7714
UEDA OSAMU,TANAHASHI TOSHIYUKI. Manufacture of semiconductor device. JP1984035432A. 1984-02-27.

入库方式: OAI收割

来源:西安光学精密机械研究所

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