中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Manufacture of semiconductor device

文献类型:专利

作者TANAHASHI TOSHIYUKI; UMEO ITSUO
发表日期1984-02-04
专利号JP1984022383A
著作权人FUJITSU KK
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor device
英文摘要PURPOSE:To prevent the deformation of the groove, etc. of the device, and to form the semiconductor device of excellent characteristics by properly selecting an atmospheric gas on liquid epitaxial growth. CONSTITUTION:The groove 3 is formed, a semiconductor wafer is set in a growth chamber brought to a nitrogen-gas atmospheric gas, the temperature of the wafer is elevated, and the state of the wafer is kept for 30min after the temperature rises to 620 deg.C. An n type In clad layer 4A, an InGaAsP active layer 5A and a p type InP clad layer 6 are grown continuously in an epitaxial manner. A p side electrode consisting of Au-Zn and an n side electrode consisting of Au-Sn are formed, and a semiconductor laser of 250(mum) resonator length is formed through cleavage. Accordingly, when the groove 3 or an irregularity is formed to a semiconductor layer and a semiconductor layer is liquid-grown on it, the deformation of the groove can be prevented by using an inert gas as the atmospheric gas, thus forming the semiconductor device having excellent characteristics with superior reproducibility.
公开日期1984-02-04
申请日期1982-07-28
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/88379]  
专题半导体激光器专利数据库
作者单位FUJITSU KK
推荐引用方式
GB/T 7714
TANAHASHI TOSHIYUKI,UMEO ITSUO. Manufacture of semiconductor device. JP1984022383A. 1984-02-04.

入库方式: OAI收割

来源:西安光学精密机械研究所

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