Semiconductor laser module and method for assembling the same
文献类型：专利
| 作者 | IIZUKA, SHINICHIRO; KIMURA, TOSHIO |
| 发表日期 | 2002-04-18 |
| 专利号 | US20020044578A1 |
| 著作权人 | FURUKAWA ELECTRIC CO., LTD., THE |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Semiconductor laser module and method for assembling the same |
| 英文摘要 | One viewpoint of the invention intends to improve the working efficiency of fabricating a semiconductor laser module. For example, each of conductive connectors is fixed to both ends of insulation coated conductors to form conductors equipped with the conductive connectors. Pins of an inner module (case) are inserted and fixed to the conductive connectors on one end side of the insulation coated conductors. Pins of a package are inserted and fixed to the conductive connectors on the other end side. A semiconductor laser device housed inside the inner module can be conducted and connected to outside the package through the pins, the insulation coated conductors and the pins. Simple work only to insert and fix the pins to the conductive connectors can conduct and connect the pins to the pins and the working efficiency of fabricating the semiconductor laser module can be enhanced. |
| 公开日期 | 2002-04-18 |
| 申请日期 | 2001-03-30 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/88595]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FURUKAWA ELECTRIC CO., LTD., THE |
| 推荐引用方式 GB/T 7714 | IIZUKA, SHINICHIRO,KIMURA, TOSHIO. Semiconductor laser module and method for assembling the same. US20020044578A1. 2002-04-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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