Optical tansmitting and receiving device and the manufacturing method
文献类型：专利
| 作者 | TERADA, KOJI; TABUCHI, HARUHIKO; TANAKA, KAZUHIRO |
| 发表日期 | 2002-03-07 |
| 专利号 | US20020027230A1 |
| 著作权人 | FUJITSU LIMITED |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optical tansmitting and receiving device and the manufacturing method |
| 英文摘要 | An insulation film (silicon dioxide film) is laminated on a platform substrate of Si, etc., and a transmitting unit wiring pattern and a receiving unit wiring pattern are provided on the insulation film. Although a base intruded in a convex shape is provided at the bottom of a light emitting device (LED) of the platform substrate, this base is not provided at the bottom of a light receiving device, and the insulation film under the light receiving device becomes thick. A groove is formed in a waveguide, and a WDM filter is mounted. A diamond or SiC layer can also be provided beneath the insulation film to improve the insulation resistance, and a conduction layer is provided beneath the diamond or SiC layer. Electrical crosstalk is suppressed by grounding the conduction layer. Optical crosstalk is improved by locating the LED at the entrance/exit of the WDM filter and the light receiving device on the opposite side. |
| 公开日期 | 2002-03-07 |
| 申请日期 | 2001-11-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/89550]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LIMITED |
| 推荐引用方式 GB/T 7714 | TERADA, KOJI,TABUCHI, HARUHIKO,TANAKA, KAZUHIRO. Optical tansmitting and receiving device and the manufacturing method. US20020027230A1. 2002-03-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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