High-Power Packaged Laser Array
文献类型：专利
| 作者 | ZHENG, XUEZHE; CUNNINGHAM, JOHN E.; KRISHNAMOORTHY, ASHOK V. |
| 发表日期 | 2019-01-24 |
| 专利号 | US20190027901A1 |
| 著作权人 | AXALUME, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | High-Power Packaged Laser Array |
| 英文摘要 | A high-power packaged laser array that is thermal reflow compatible is described. Notably, a high-power III-V laser array is integrated on a silicon substrate with a matching array of ball lenses, an isolator and a coupler (such as a reflective layer) to achieve an edge-coupled or a surface-normal output laser array. In some embodiments, an isolator with a permanent magnet is used to preserve the magnetic domain or state of the isolator during the thermal reflow(s), which can involve temperatures up to 250 C. In order to relax the misalignment tolerance when integrating with the silicon chip, a laser array with a larger optical mode may be used to increase the output beam size. Moreover, a III-V laser array with an angled output optical waveguide can be used to improve the stability of the lasers at high power. |
| 公开日期 | 2019-01-24 |
| 申请日期 | 2018-07-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/89905]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AXALUME, INC. |
| 推荐引用方式 GB/T 7714 | ZHENG, XUEZHE,CUNNINGHAM, JOHN E.,KRISHNAMOORTHY, ASHOK V.. High-Power Packaged Laser Array. US20190027901A1. 2019-01-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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