Semiconductor module
文献类型：专利
| 作者 | YAMAUCHI, YASUYUKI |
| 发表日期 | 2019-09-17 |
| 专利号 | US10416400 |
| 著作权人 | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor module |
| 英文摘要 | A semiconductor module is disclosed. The semiconductor module includes a housing that encloses on a bottom thereof a spacer and a wiring substrate that mounts a semiconductor element thereon. The housing includes a feedthrough that secures one end of a transmission substrate. The other end of the transmission substrate faces the wiring substrate and the spacer. The other end of the transmission substrate provides a lower end and an upper end that form an extension protruding toward the wiring substrate. The upper end is set so close to the wiring substrate but the lower end forms a space for receiving a surplus adhesive oozing between the spacer and the wiring substrate. |
| 公开日期 | 2019-09-17 |
| 申请日期 | 2017-11-21 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/89930]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
| 推荐引用方式 GB/T 7714 | YAMAUCHI, YASUYUKI. Semiconductor module. US10416400. 2019-09-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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