Moulded lead-frame assembly for arrays of individual photonic device dies
文献类型：专利
| 作者 | PRADEEP, RAJKOMAR; WILLIAMS, J, BEECHER |
| 发表日期 | 1999-07-14 |
| 专利号 | GB2333180A |
| 著作权人 | HEWLETT-PACKARD COMPANY |
| 国家 | 英国 |
| 文献子类 | 发明申请 |
| 其他题名 | Moulded lead-frame assembly for arrays of individual photonic device dies |
| 英文摘要 | Arrays of photonic devices dies such as LEDs or VCSELs 122 are mounted in an injection moulded dielectric lead frame 108. Each die is contained in a cavity 110 where an upper ring portion has a first contact 114 which is wire bonded 124 to the device die 122 and a cavity base portion 120 which has a second electrical contact to the die base. Separate leg leads 114, 118 pass from the cavity through the moulded lead frame to external contacts. The first and second contacts are electrically isolated from each other, and the first contacts may be isolated from each other or connected in separate rows or as a whole array. The inner walls of the cavity 126 may be made reflective, the cavity may be filled with silicone and the top surface of the lead-frame and cavities may be covered with an optical diffusing film or tape. |
| 公开日期 | 1999-07-14 |
| 申请日期 | 1999-01-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/92617]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HEWLETT-PACKARD COMPANY |
| 推荐引用方式 GB/T 7714 | PRADEEP, RAJKOMAR,WILLIAMS, J, BEECHER. Moulded lead-frame assembly for arrays of individual photonic device dies. GB2333180A. 1999-07-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。