VCSEL Packaging
文献类型：专利
| 作者 | WANG, QING; SEURIN, JEAN-FRANCOIS; GHOSH, CHUNI LAL; WATKINS, LAURENCE |
| 发表日期 | 2015-03-12 |
| 专利号 | US20150069113A1 |
| 著作权人 | PRINCETON OPTRONICS INC |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | VCSEL Packaging |
| 英文摘要 | A process to bond VCSEL arrays to submounts and printed circuit boards is provided. The process is particularly suited to large area thin and ultra-thin VCSEL arrays susceptible to bending and warping. The process integrates a flatness measurement step and applying appropriate combination of pressure prior to bonding the VCSEL array to the submount or a printed circuit using a vacuum flux-less bonding process. The process is very promising in making very good quality bonding between the VCSEL array and a submount or a printed circuit board. The process is applied to construct optical modules with improved flatness that may be integrated with other electronic components in constructing optoelectronic systems. |
| 公开日期 | 2015-03-12 |
| 申请日期 | 2014-09-07 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/92939]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PRINCETON OPTRONICS INC |
| 推荐引用方式 GB/T 7714 | WANG, QING,SEURIN, JEAN-FRANCOIS,GHOSH, CHUNI LAL,et al. VCSEL Packaging. US20150069113A1. 2015-03-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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