High power 250W CW conductively cooled diode laser arrays with low-smile
文献类型:会议论文
作者 | Zhang, Hongyou1,2,4; Zhu, Pengfei4; Fu, Tuanwei4; Li, Meiqin4; Lv, Ning4; Li, Wenwei4; Zah, Chung-En4; Liu, Xingsheng2,3,4 |
出版日期 | 2020 |
会议日期 | 2020-02-03 |
会议地点 | San Francisco, CA, United states |
关键词 | High power low smile conductive cooling packaging technology |
卷号 | 11261 |
DOI | 10.1117/12.2540399 |
英文摘要 | We have simulated and optimized a conductive cooling structure including the distribution of temperature in active layer, and the deformation of laser to achieve high power operation with low SMILE value. Unlike the traditional conductive cooling structure, our structure improves the heat dissipation efficiency from three aspects: with angle structure in the front of heat sink; double side heat dissipation and without submount packaging technology. In this report, an output power of more than 250W CW from a 4 mm long laser bar with a filling factor of 50% is shown at 240A driving current with a power conversion efficiency of 65%. The thermal rollover of this packaging conductive cooling device can reach 385W at 400A driving current. © COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only. |
产权排序 | 1 |
会议录 | Components and Packaging for Laser Systems VI |
会议录出版者 | SPIE |
语种 | 英语 |
ISSN号 | 0277786X;1996756X |
ISBN号 | 9781510632851 |
源URL | [http://ir.opt.ac.cn/handle/181661/93414] |
专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
通讯作者 | Zhang, Hongyou |
作者单位 | 1.State Key Laboratory of Transient Optics and Photonics, Xi'An Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an, Shanxi; 710077, China; 2.University of Chinese Academy of Sciences, Beijing; 100049, China; 3.Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing; 100049, China; 4.Focuslight Technologies Inc., Xi'an, Shanxi; 710077, China |
推荐引用方式 GB/T 7714 | Zhang, Hongyou,Zhu, Pengfei,Fu, Tuanwei,et al. High power 250W CW conductively cooled diode laser arrays with low-smile[C]. 见:. San Francisco, CA, United states. 2020-02-03. |
入库方式: OAI收割
来源:西安光学精密机械研究所
其他版本
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。