Research on ultra-smooth collimation separation of silicon wafer by multiple lasers
文献类型：会议论文
| 作者 | Youwang, Hu1; Ming, Li2; Qinqin, Xie1; Xiaoyan, Sun1 |
| 出版日期 | 2020-05 |
| 会议日期 | 2020-05-01 |
| 会议地点 | Suzhou, China |
| 关键词 | silicon wafer laser thermal cracking prefabricated crack |
| DOI | 10.1109/ICEDME50972.2020.00109 |
| 页码 | 454-457 |
| 英文摘要 | Micro-cracks are prefabricated on the surface of the silicon wafer, and laser thermal cracking is used to dice the silicon wafer, which can greatly reduce the surface roughness of the cross section of the wafer, improve the straightness after cutting, and achieve high-quality dicing of silicon wafers. This is a new dicing technology with huge application value. © 2020 IEEE. |
| 产权排序 | 2 |
| 会议录 | Proceedings - 2020 3rd International Conference on Electron Device and Mechanical Engineering, ICEDME 2020
 |
| 会议录出版者 | Institute of Electrical and Electronics Engineers Inc. |
| 语种 | 英语 |
| ISBN号 | 9781728181455 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/93591]  |
| 专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
| 通讯作者 | Xiaoyan, Sun |
| 作者单位 | 1.Central South University, State Key Laboratory of High Performance Complex Manufacturing, College of Mechanical and Electrical Engineering, Changsha, China; 2.Xi'An Institute of Optics and Precision Mechanics of CAS, State Key Laboratory of Transient Optics and Photonics, Xi'an, Shanxi; 710119, China |
| 推荐引用方式 GB/T 7714 | Youwang, Hu,Ming, Li,Qinqin, Xie,et al. Research on ultra-smooth collimation separation of silicon wafer by multiple lasers[C]. 见:. Suzhou, China. 2020-05-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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